Development of Temperature–Time and Pressure–Time Diagrams for Diffusion Bonding Ti – AA7075 Aluminium Alloys

1N. Sithivinayagam, R. Hariharan, R. Praveen Rackson, V. Pravin Kumar andRubeshwaren

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Abstract:

Two dissimilar aerospace materials Cp Ti and AA7075 were joined by diffusion bonding. When joining these dissimilar material, go for Trial and error method. From this investigation, developing diffusion bonding windows for Cp Ti – AA7075 of dissimilar materials. The quality of the bond of the joints were tested by microhardness, microstructure analysis and lap shear testing.

Keywords:

Diffusion Bonding, Aluminium Alloys, Development of Temperature, Time and Pressure

Paper Details
Month5
Year2019
Volume23
IssueIssue 3
Pages10-22